Polishing pad

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Polishing Grinding Pad

Application fields

It is used for grinding and polishing of optical elements, crystals, metal and glass materials, and also for grinding and polishing of special materials, such as the following polishing of silicon, zinc selenide, and gallium arsenide.


White damping cloth polishing pad:

With excellent interconnected microporous structure, it has outstanding removal rate, polishing stability, and wear resistance in case of rough polishing. Together with grinding and polishing fluid series products, it is used for rough polishing or medium polishing of materials or workpieces such as ceramics, gallium arsenide, indium phosphide, hard disc, optical glass, metal products, sapphire substrate wafer, and silicon carbide wafer, so as to obtain the wafer surface without defects.


Appearance

White

Shape

Circular

Thickness

T0.5-3.0mmn

Shore Hardness (A)

70-95±2

Groove

T&U-shaped Groove 10-20mm

Groove depth

0.8±0.2mm

Groove Width

1.8±0.2mm

Density

0.47±0.03g/mm3

Inner Adhesion

2800 (gf/20mm)

Outer adhesion

2600 (gf/20mm)

Percentage of Elongation (Compression Ratio)

6.3±3%

Gum

3M imported PET double-sided tape

Regular Specification

Φ127/Φ180/Φ610/Φ710/Φ820/Φ920/Φ980/Φ1100-Φ1280mm


Advantages of white polishing pad:

1) It has high removal rate, stable quality, good wear resistance;

2) With moderate softness and elasticity, it can avoid scratches effectively;

3) A large amount of polishing fluid can be stored in the intervillous space on the surface, so as to improve the polishing efficiency;

4) It is easy to tear off the gum without the adhesive residual, so it can be used easily.


Instructions for use:

1. Tear off the release paper on the back of the polishing pad, and attach the polishing pad uniformly onto the operating surface of the bench, and pay attention not to keep any bubbles;

2. Use together with alumina or silicon oxide series grinding fluid;

3. Please clean with clean water after each use.


Black damping cloth polishing pad

With excellent interconnected microporous structure, it has outstanding polishing stability and wear resistance in case of polishing. Together with grinding and polishing fluid series products, it is used for high planarization super-precision polishing of wafer, sapphire, quartz, glass, metal, and ceramic with the accuracy up to 0.0002 after polishing, so as to achieve the perfect mirror effect.


Appearance

Black

Shape

Circular

Thickness

T0.5-3.0mmn

Shore Hardness (A)

70-90±2

Groove

Groove 0.5-20mm

Groove depth

0.5±0.2mm

Groove Width

1.8±0.2mm

Density

0.60±0.05g/mm3

Inner Adhesion

2800 (gf/20mm)

Outer adhesion

2600 (gf/20mm)

Percentage of Elongation (Compression Ratio)

6.3±3%

Gum

3M imported PET double-sided tape

Regular Specification

Φ127/Φ180/Φ610/Φ710/Φ820/Φ920/Φ980/Φ1100-Φ1280mm



Advantages of black polishing pad:

1) It has stable quality and good wear resistance;

2) With moderate softness and elasticity, it can avoid scratches effectively;

3) A large amount of polishing fluid can be stored in the intervillous space on the surface, so as to improve the polishing efficiency;

4) It is easy to tear off the gum without the adhesive residual, so it can be used easily.


Instructions for use:

1. Tear off the release paper on the back of the polishing pad, and attach the polishing pad uniformly onto the operating surface of the bench, and pay attention not to keep any bubbles;

2. Use together with alumina or silicon oxide series grinding fluid;

3. Please clean with clean water after each use.

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