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Al2o3 polishing slurry

Mainly composed of high purity alumina, it is particularly suitable for polishing of high hardness substances and semiconductor materials, such as sapphire, and zinc selenide. It has the advantages of good dispersion and stability, high removal rate, small surface roughness, no damage to the workpieces, and easy cleaning.


Main features

High removal rate: Based on the high hardness of the alumina itself, it is possible to make into large particle size to achieve a higher removal amount;

Wide range of particle size range: It is possible to make into the minimum particle size of 30nm, and the maximum particle size of dozens or even hundreds of microns;

More choices: It may be made into water, oil, wax, and paste according to the customer needs;

It has good dispersion and suspension, stable quality, and long polishing life;

It has high quality polished surface without cedrate dots, pitting, scratch, and other defects;

It is easy to clean but less liable to hardening.


Particle size distribution and application scenarios

Model

Appearance

PH Value

Solid Content %

Particle Size μm

Package (kg)

MMP037

Milk white liquid

Alkaline

20

0.2-0.5

5/25

MMP038

Milk white liquid

Alkaline

20-30

0.1-0.2

5/25

MMP099

Milk white liquid

Alkaline

20

< 0.1

5/25

MMP103

Milk white liquid

Acidic

10-30

> 1

5/25

MMP-S300

Milk white liquid

Acidic

10-20

2-3

5/25


Application fields

Metallic materials, such as stainless steel, aluminum parts, and zinc alloy;

Sapphire optical wafer, LED sapphire substrate, watch lens, crystal, and gem;

Optical lens, optical glass, and quartz;

Fiber optic and photovoltaic enterprises;

Ceramics, ceramic substrate, alumina ceramics, zirconia ceramics, aluminum nitride substrate, ceramic mobile phone cover plate, and wearable ceramics.


Packing specification

5KG/25KG, barrel (To be customized according to customer needs).


Storage method

The product shall be stored at 5?C– 35?C, and prevented from exposure to direct sunlight.

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